The G-ray latenium™ Monolithic Detector
will offer SIGNIFICANTLY higher spatial resolution with much reduced radiation doses.
COMPETITIVE ADVANTAGES
The latenium™ detector first demonstrator is ready as of January 2020
THE DETECTOR EXPLAINED
G-ray’s core product is a monolithic (= no bump-bonding) CMOS integrated pixel array detector, using a digital direct conversion mode.
This digital direct conversion mode :
(1) minimises image blurring
(2) allows energy discrimination
(3) permits high speed readout
(4) lowers dose procedures
IT RELIES ON
- a combination of materials that define the sensitivity of the absorption layers,
- smart electronics for signal processing, storage and post-processing,
- a low temperature direct bonding technology without the need of any special high-temperature metallization layers.
Through the combination of the best available technologies, this new type of sensor has unique advantages in terms of spatial, energy and temporal resolution over all present bump-bonded detectors based on planar Si, CdTe or CdZnTe absorbers, as well as the monolithically integrated Si absorbers.
G-ray’s equipment permits space-filling arrays of tall germanium crystals to be synthesized, acting as pixel sensor.
G-ray’s monolithic X-ray photon imaging detector with one ASIC wafer, using Wafer-to-Wafer direct bonding without middle TSVs.
PCT Application number: IB2015/002385 | Inventor: Hans von Känel | Applicant: G-ray Switzerland SA
Title: Monolithic CMOS integrated pixel detector, and systems and methods for particle detection and imaging including various applications
