New patent filed (5)

US Patent and Trademark Office acknowledged receipt of the following provisional patent application: Application number: US 62/381,647 Inventor: Hans…

CSEM collaboration

Collaboration signed with CSEM G-ray has signed with CSEM – Centre Suisse d’Electronique et de Microtechnique SA, Neuchâtel – a collaboration…

Fundraising: closing Series A first tranche

G-ray Switzerland could successfully achieve the closing of its Series A first tranche.

Low temperature direct bonding process

The G-ray team has defined a direct bonding process at low temperature allowing an efficient charge collection across bonded semiconductor wafers.…

New patent filed (4)

US Patent and Trademark Office acknowledged receipt of the following provisional patent application: Application number: US 62/334,514 Inventor: Hans…

New patent filed (3)

US Patent and Trademark Office acknowledged receipt of the following provisional patent application: Application number: US 62/295,720 Inventor: Hans…

Proof of concept

The G-ray team could achieve an efficient charge collection across bonded interfaces. By demonstrating the validity of this effect, the company is…