22/10/2016
New patent filed (5)
US Patent and Trademark Office acknowledged receipt of the following provisional patent application: Application number: US 62/381,647 Inventor: Hans…
15/08/2016
CSEM collaboration
Collaboration signed with CSEM G-ray has signed with CSEM – Centre Suisse d’Electronique et de Microtechnique SA, Neuchâtel – a collaboration…
22/07/2016
Fundraising: closing Series A first tranche
G-ray Switzerland could successfully achieve the closing of its Series A first tranche.
29/03/2016
Low temperature direct bonding process
The G-ray team has defined a direct bonding process at low temperature allowing an efficient charge collection across bonded semiconductor wafers.…
11/03/2016
New patent filed (4)
US Patent and Trademark Office acknowledged receipt of the following provisional patent application: Application number: US 62/334,514 Inventor: Hans…
16/02/2016
New patent filed (3)
US Patent and Trademark Office acknowledged receipt of the following provisional patent application: Application number: US 62/295,720 Inventor: Hans…
13/01/2016
Proof of concept
The G-ray team could achieve an efficient charge collection across bonded interfaces. By demonstrating the validity of this effect, the company is…